Teardown and BoM Analysis
Huawei Kirin 9000s Chip-level Teardown Analysis
This report offers a detailed teardown analysis of the Huawei Kirin 9000s chipset, which powers the Huawei Mate 60 Pro smartphone released in August 2023.
It delves into the physical characteristics, architectural details, and performance capabilities of the chipset and speculates on the manufacturing process and the entities involved in its fabrication.
• Huawei Mate 60 Pro Key Specifications
• Kirin 9000s Analysis – Summary Table
• OM Image Analysis
• X-Ray Image Analysis
• Top View Analysis
• DB-FIB Profile and Metal/CNT Size
• Die Shot Layout Analysis
• Summary and Implication
For more information, send us an enquiry and our team will get in touch with you.
BoM Analysis for Apple Vision Pro
The report is an analysis of the Bill of Materials covering the components that constitute the Apple Vision Pro. This will help in understanding the cost structure and components.
• Key components specifications
• Function-level costs
• Components suppliers
• Profit margin analysis
For more information, send us an enquiry and our team will get in touch with you.