Overview:
This report offers a detailed teardown analysis of the Huawei Kirin 9000s chipset, which powers the Huawei Mate 60 Pro smartphone released in August 2023. It delves into the physical characteristics, architectural details, and performance capabilities of the chipset and speculates on the manufacturing process and the entities involved in its fabrication.
Table of Contents:
- Huawei Mate 60 Pro Key Specifications
- Kirin 9000s Analysis – Summary Table
- OM Image Analysis
- XRay Image Analysis
- Top View Analysis
- DB-FIB Profile and Metal/CNT Size
- Die Shot Layout Analysis
- Summary and Implication
Number of Pages: 25
Published Date: April 2024